Polishing surface constituting member and polishing apparatus using the polishing surface constituting member

ABSTRACT

A polishing surface constituting member capable of polishing an object surface flat and uniformly with minimal overpolishing at the edge of the object is provided, together with a polishing apparatus using the polishing surface constituting member. The polishing surface constituting member polishes the object pressed against it under a predetermined pressure by relative movement therebetween. A surface of the polishing surface constituting member that comes in contact with the object is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a polishing surface constitutingmember used in a polishing apparatus for polishing an object to bepolished, e.g. a semiconductor substrate. More particularly, the presentinvention relates to a polishing surface constituting member suitablefor polishing a surface of a polishing object flat and uniformly withoutoverpolishing at the edge of the object. The present invention alsorelates to a polishing apparatus using the polishing surfaceconstituting member.

[0002] A polishing apparatus for polishing an object to be polished,e.g. a semiconductor substrate, has a polishing table with a polishingsurface constituting member bonded to the upper surface thereof. Thepolishing apparatus further has a top ring for holding a substrate as anobject to be polished, and an abrasive liquid supply nozzle. While anabrasive liquid is being supplied onto the polishing surfaceconstituting member from the abrasive liquid supply nozzle, thesubstrate to be polished that is held by the top ring is pressed againstthe polishing surface constituting member under a predeterminedpressure, and the polishing table and the top ring are rotated to causerelative movement between the polishing surface constituting member andthe substrate, thereby polishing the substrate. It should be noted thatthe term “polishing surface constituting member” as used herein means apolishing pad, an abrasive wheel having a polishing surface, asheet-shaped member containing abrasive grains, etc.

[0003] As the degree of integration of semiconductor devices increases,it is increasingly demanded that substrates to be polished, e.g.semiconductor substrates, should be polished flat and uniformly. Topolish a substrate flat and uniformly, the general practice is to pressthe whole surface of the substrate against the surface of a polishingsurface constituting member under a uniform pressure. However, becausethe polishing surface constituting member has elasticity, as shown inFIG. 12, the polishing surface constituting member 20 is deformed duringpolishing in the vicinity of a portion thereof that comes in contactwith the edge 10 a of the substrate 10. Accordingly, the surface of thesubstrate 10 to be polished cannot uniformly be pressed against thepolishing surface constituting member 20. More specifically, thepolishing surface constituting member 20 is deformed downwardly by beingpressed with the substrate 10 being polished. At this time, aparticularly high pressure is applied to the edge 10 a of the substrate10, causing the edge 10 a to be overpolished. This is known as “edgerounding”.

[0004] Further, in the vicinity of the edge 10 a of the substrate 10,the polishing surface constituting member 20 cannot follow the geometryof the substrate 10 because it is deformed downwardly by the edge 10 aof the substrate 10. That is, a rebound region occurs as shown in FIG.13. Accordingly, at the rebound region with a width D, the pressureapplied to the polishing surface constituting member 20 reduces, andhence the polishing rate reduces. Consequently, flat and uniformpolishing cannot be attained. It should be noted that FIG. 13 is anenlarged view of part A in FIG. 12.

[0005] As shown in FIG. 14, a polishing pad 20-1 generally used as thepolishing surface constituting member 20 has a double-layer structureincluding a relatively hard first layer 21 formed by using IC-1000 orthe like, and a relatively soft second layer 22 made of SUBA400 or thelike. In the polishing pad 20-1, the relatively hard first layer 21forms a surface that comes in contact with the substrate 10 to polishit. The relatively soft second layer 22, which is an underlying layer,allows the first layer 21 to follow surface waviness or the like of thesubstrate 10. However, because the first layer 21 is a relatively hardlayer, follow-up capability undesirably reduces in the vicinity of theedge 10 a of the substrate 10. Consequently, the width D of the reboundregion becomes about 6 mm. Thus, overpolishing at the edge 10 a of thesubstrate 10 cannot be reduced.

[0006] In general, the polishing surface constituting member 20 needs toretain an abrasive liquid. Therefore, the surface of the polishingsurface constituting member 20 is provided with a large number ofgrooves 23 in a lattice configuration as shown in FIG. 15, or providedwith a large number of holes 24 as shown in FIG. 16. However, thegrooves 23 and the holes 24 are not provided to prevent overpolishing atthe edge 10 a of the substrate 10 and hence have no function ofpreventing overpolishing at the edge 10 a of the substrate 10.

SUMMARY OF THE INVENTION

[0007] The present invention has been made in view of theabove-described circumstances.

[0008] Accordingly, one purpose of the present invention is to provide apolishing surface constituting member capable of polishing a surface ofa polishing object flat and uniformly with minimal overpolishing at theedge of the object.

[0009] Another purpose of the present invention is to provide apolishing apparatus using the above-described polishing surfaceconstituting member.

[0010] According to a first aspect of the present invention, a polishingsurface constituting member is provided for polishing an object to bepolished by pressing the object against the polishing surfaceconstituting member under a predetermined pressure and causing relativemovement between the object and the polishing surface constitutingmember. A surface of the polishing surface constituting member thatcomes in contact with the object is provided with grooves at apredetermined pitch or provided with projections in a predeterminedconfiguration.

[0011] According to the above-described structure of the presentinvention, the surface of the polishing surface constituting member thatcomes in contact with the object to be polished is provided with groovesat a predetermined pitch or provided with projections in a predeterminedconfiguration. Therefore, the follow-up capability of the polishingsurface constituting member with respect to the object being polished isimproved, and overpolishing at the edge of the object to be polished isminimized. Accordingly, the surface of the object can be polished flatand uniformly.

[0012] In addition, the present invention provides a polishing surfaceconstituting member for polishing an object to be polished by pressingthe object against the polishing surface constituting member under apredetermined pressure and causing relative movement between the objectand the polishing surface constituting member. A surface of thepolishing surface constituting member that comes in contact with theobject is provided with a large number of disk-shaped projections at apredetermined pitch suitable for improving follow-up capability withrespect to the object being polished and for preventing overpolishing atthe edge of the object, whereby grooves are provided between thedisk-shaped projections.

[0013] According to the above-described structure of the presentinvention, the surface of the polishing surface constituting member thatcomes in contact with the object to be polished is provided with a largenumber of disk-shaped projections at a predetermined pitch suitable forimproving follow-up capability with respect to the object being polishedand for preventing overpolishing at the edge of the object, wherebygrooves are provided between the disk-shaped projections. Therefore, thefollow-up capability of the polishing surface constituting member withrespect to the object being polished is improved, and overpolishing atthe edge of the object to be polished is minimized. Accordingly, thesurface of the object can be polished flat and uniformly.

[0014] According to a second aspect of the present invention, thepolishing surface constituting member according to the first aspect ofthe present invention has a laminated structure including at least twolayers, and the grooves or grooves provided between the projectionsextend to the surface of a layer of the polishing surface constitutingmember immediately subsequent to a layer thereof that comes in contactwith the object to be polished.

[0015] According to the above-described structure of the presentinvention, the polishing surface constituting member has a laminatedstructure including at least two layers, and the grooves or groovesprovided between the projections extend to the surface of a layer of thepolishing surface constituting member immediately subsequent to a layerthereof that comes in contact with the object to be polished. Therefore,the follow-up capability of the polishing surface constituting memberwith respect to the object being polished is further improved, andoverpolishing at the edge of the object to be polished is furtherminimized. Accordingly, the surface of the object can be polished evenmore flat and uniformly.

[0016] According to a third aspect of the present invention, thepolishing surface constituting member according to the first aspect ofthe present invention has a laminated structure including at least twolayers, and the grooves or grooves provided between the projectionsextend into a layer of the polishing surface constituting memberimmediately subsequent to a layer thereof that comes in contact with theobject to be polished.

[0017] According to the above-described structure of the presentinvention, the polishing surface constituting member has a laminatedstructure including at least two layers, and the grooves or groovesprovided between the projections extend into a layer of the polishingsurface constituting member immediately subsequent to a layer thereofthat comes in contact with the object to be polished. Therefore, thewidth of the grooves can be narrowed without degrading the follow-upcapability of the polishing surface constituting member with respect tothe object being polished, and the surface of the object can be polishedstill more flat and uniformly.

[0018] According to a fourth aspect of the present invention, thepolishing surface constituting member according to the second or thirdaspect of the present invention is arranged such that at least one ofunderlying layers of the polishing surface constituting membersubsequent to the layer thereof that comes in contact with the object tobe polished is a layer pressurized by a fluid.

[0019] According to the above-described structure of the presentinvention, at least one of underlying layers of the polishing surfaceconstituting member subsequent to the layer thereof that comes incontact with the object to be polished is a layer pressurized by afluid. Therefore, the follow-up capability of the polishing surfaceconstituting member with respect to the object being polished is furtherimproved by properly varying the pressure of the fluid. Accordingly,overpolishing at the edge of the object to be polished is minimized, andthe surface of the object can be polished flat and uniformly. Even ifthe layer of the polishing surface constituting member that comes incontact with the object to be polished is reduced in thickness, stablepolishing can be performed because the pressure applied to the object tobe polished can be held constant.

[0020] According to a fifth aspect of the present invention, there isprovided a polishing apparatus for polishing an object to be polished bypressing the object against a polishing surface constituting member on apolishing table under a predetermined pressure and causing relativemovement between the object and the polishing surface constitutingmember. The polishing surface constituting member of the polishingapparatus is the polishing surface constituting member according to anyone of the first to fourth aspects of the present invention.

[0021] According to the above-described structure of the presentinvention, the polishing surface constituting member according to anyone of the first to fourth aspects of the present invention is used asthe polishing surface constituting member of the polishing apparatus.Therefore, the polishing apparatus can polish the surface of the objectflat and uniformly.

[0022] The above and other functions, features and advantages of thepresent invention will become more apparent from the followingdescription of the preferred embodiments thereof, taken in conjunctionwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0023]FIG. 1 is a cross-section of an essential part of a polishing padused as a polishing surface constituting member according to the presentinvention, showing a structural example thereof.

[0024]FIG. 2 is a graph showing the results of polishing a substrate asan object to be polished.

[0025]FIG. 3 is an enlarged view of part B in FIG. 2.

[0026]FIG. 4 is a partly-sectioned perspective of an essential part of apolishing pad used as a polishing surface constituting member accordingto the present invention, showing another structural example thereof.

[0027]FIG. 5 is a cross-section showing an essential part of anotherembodiment of the polishing surface constituting member according to thepresent invention.

[0028]FIG. 6 is a cross-section showing an essential part of stillanother embodiment of the polishing surface constituting memberaccording to the present invention.

[0029]FIG. 7 is a cross-section showing an essential part of a furtherembodiment of the polishing surface constituting member according to thepresent invention.

[0030]FIG. 8 is a schematic sectional view showing a further embodimentof the polishing surface constituting member according to the presentinvention.

[0031]FIG. 9 is a diagram showing a structural example of a polishingapparatus using the polishing surface constituting member according tothe present invention.

[0032]FIG. 10 is a perspective showing another structural example of apolishing apparatus using the polishing surface constituting memberaccording to the present invention.

[0033]FIG. 11 is a diagram showing still another structural example of apolishing apparatus using the polishing surface constituting memberaccording to the present invention.

[0034]FIG. 12 is a diagram showing problems associated with aconventional polishing surface constituting member.

[0035]FIG. 13 is an enlarged view of part A in FIG. 12.

[0036]FIG. 14 is a cross-section of a conventional polishing pad.

[0037]FIG. 15 is a diagram showing a structural example of aconventional polishing surface constituting member.

[0038]FIG. 16 is a diagram showing another structural example of aconventional polishing surface constituting member.

EXPLANATION OF REFERENCE NUMERALS

[0039]1: polishing surface constituting member

[0040]1-1: polishing pad

[0041]1-2: polishing sheet

[0042]2: first layer

[0043]3: second layer

[0044]4: grooves

[0045]5: projections

[0046]6: intermediate layer

[0047]7: layer member

[0048]7 a: fluid inlet

[0049]10: substrate to be polished

[0050]11: turntable

[0051]12: top ring

[0052]13: abrasive liquid supply nozzle

[0053]14: top ring shaft

[0054]15: oscillating arm

[0055]16: motor

[0056]17: guide ring

[0057]20: polishing surface constituting member

[0058]20-1: polishing pad

[0059]30: back plate

[0060]31: polishing sheet feed drum

[0061]32: polishing sheet take-up drum

[0062]33: polishing table

[0063]34: rotary drum

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0064] Embodiments of the present invention will be described below indetail with reference to the accompanying drawings. FIG. 1 is across-section showing an essential part of a polishing pad 1-1 used as apolishing surface constituting member 1 according to the presentinvention. The polishing pad 1-1 is composed of two layers, i.e. a firstlayer 2, and a second layer 3.

[0065] The first layer 2 is made of a relatively hard material, e.g.IC-1000. The surface of the first layer 2 is provided with grooves 4extending short of the surface of the second layer 3 in such a mannerthat the pitch (interval) L of the grooves 4 is L=5 mm. The second layer3 is made of a relatively soft material, e.g. SUBA400.

[0066] A substrate 10 to be polished is pressed against the polishingpad 1-1 under a predetermined pressure and polished by relative movementbetween them. During the polishing process, it becomes easy for thepolishing pad 1-1 to follow the substrate 10 because the first layer 2is thin in thickness at portions where the grooves 4 are provided. FIG.2 is a graph showing the results of polishing the substrate 10. FIG. 3is an enlarged view of part B in FIG. 2. In this embodiment, the grooves4 provided in the polishing pad 1-1 each have a width of 1 mm and adepth of 1 mm, and the substrate 10 to be polished has a circular shapewith an outer diameter of 8 inches. In FIGS. 2 and 3, the abscissa axisrepresents the distance (mm) from the center of the substrate 10, andthe ordinate axis represents the stock removal (Polishing Amount) (Å) inpolishing of the substrate 10.

[0067] It will be understood from FIGS. 2 and 3 that when the pitch L is5 mm, overpolishing at an edge 10 a of the substrate 10 that extendsover a range of about 5 mm (and a range of about 1 mm not to bemeasured) from the outer periphery thereof is reduced in comparison to acase where the pitch L is 10 mm. The reason for this is that theoccurrence of a rebound region in the vicinity of the edge 10 a of thesubstrate 10 is suppressed owing to an improvement in follow-upcapability of the polishing pad 1-1. Also, it should be noted that arebound of the polishing pad 1-1 at the edge 10 a that extends over arange of about 3 mm from the outer periphery of the substrate 10 isfurther reduced when the pitch L is 3 mm (see FIG. 3). Thus,overpolishing and the rebound of the polishing pad 1-1 at the edge 10 acan be reduced by setting the pitch L of the grooves 4 in the polishingpad 1-1 at 5 mm or less.

[0068] It should be noted that there is no particular restriction on theconfiguration of the grooves 4 provided in the surface of the polishingpad 1-1. As shown in FIG. 15, a large number of grooves 4 may beprovided in a lattice configuration. Alternatively, grooves 4 may beformed by providing a large number of disk-shaped projections 5 as shownin FIG. 4.

[0069] The depth of the grooves 4 provided in the surface of thepolishing surface constituting member 1 is not necessarily limited tothe one that is short of the surface of the second layer 3. As shown inFIG. 5, the grooves 4 may extend to the surface of the second layer 3.Alternatively, the grooves 4 may extend into the second layer 3 as shownin FIG. 6. In a case where the grooves 4 are provided to extend to thesurface of the second layer 3 of the polishing surface constitutingmember 1, the follow-up capability of the polishing surface constitutingmember 1 is further improved, and the occurrence of a rebound region inthe vicinity of the edge 10 a of the substrate 10 is further suppressed.When the grooves 4 are provided to extend into the second layer 3 of thepolishing surface constituting member 1, the follow-up capability of thepolishing surface constituting member 1 will not be degraded even if thewidth of the grooves 4 is narrowed. Further, because the area with whichthe first layer 2 comes in contact with the substrate 10 increases, thesurface of the substrate 10 can be polished even more flat and even moreuniformly.

[0070]FIG. 7 is a cross-section showing an essential part of a furtherembodiment of the polishing surface constituting member according to thepresent invention. The polishing surface constituting member 1 accordingto this embodiment has a triple-layer structure in which an elasticintermediate layer 6 made, for example, of rubber or urethane foam isprovided between a relatively hard first layer 2 and a relatively softsecond layer 3. Provision of the intermediate layer 6 makes it possibleto minimize rapid changes in elasticity even when the first layer 2 isreduced in thickness. Regarding the depth of the grooves 4 in thisembodiment, the grooves 4 may be provided to extend through the firstlayer 2. Alternatively, the grooves 4 may be provided to extend into theintermediate layer 6 or as far as the inside of the second layer 3.Although in this embodiment the polishing surface constituting member 1has a triple-layer structure, the present invention is not necessarilylimited thereto. The polishing surface constituting member 1 may have alaminated structure including more than three layers.

[0071]FIG. 8 is a schematic sectional view showing a further embodimentof the polishing surface constituting member according to the presentinvention. The polishing surface constituting member 1 according to thisembodiment has a layer member 7 as a layer underlying a relatively hardfirst layer 2. The layer member 7 is capable of accommodating a fluid Ftherein. The layer member 7 can be expanded or contracted by varying thepressure of the fluid accommodated therein. More specifically, the layermember 7 expands as the pressure therein is increased by introducing thefluid into the layer member 7 from a fluid inlet 7 a. During polishingof the substrate 10, the pressure in the layer member 7 is variedappropriately, whereby it is possible to further improve the follow-upcapability of the polishing surface constituting member 1 with respectto the substrate 10 being polished. Even when the first layer 2 isreduced in thickness, stable polishing can be performed because thepressure applied to the substrate 10 can be held constant. It should benoted that a polishing surface constituting member 1 having a laminatedstructure including three or more layers can also perform stablepolishing by having the layer member 7 as the lowermost layer.

[0072] Next, a polishing apparatus using the polishing surfaceconstituting member according to the present invention will bedescribed. FIG. 9 is a diagram showing a structural example of apolishing apparatus using the polishing surface constituting memberaccording to the present invention. The polishing apparatus includes aturntable 11 having the polishing surface constituting member 1according to the present invention bonded to the upper surface thereof.The polishing apparatus further includes a top ring 12 for holding asubstrate 10 to be polished in such a manner that the substrate 10 isrotatable and capable of being pressed against the polishing surfaceconstituting member 1. Further, the polishing apparatus includes anabrasive liquid supply nozzle 13 for supplying an abrasive liquid Q tothe polishing surface constituting member 1. The top ring 12 isconnected to a top ring shaft 14. The top ring shaft 14 is rotatable bya rotating device (not shown), e.g. a motor, provided in an oscillatingarm 15. The top ring shaft 14 is also vertically movable by a verticallymoving mechanism (not shown), e.g. a cylinder, provided in theoscillating arm 15. The top ring shaft 14 is supported by theoscillating arm 15 through bearings (not shown). The oscillating arm 15is supported in such a manner as to be oscillatable, together with thetop ring 12 as one unit, over a predetermined angle range in ahorizontal plane parallel to the polishing surface constituting member 1by a motor 16.

[0073] The top ring 12 has the substrate 10 attached on the lowersurface thereof by a holding device (not shown). The top ring 12 has acylindrical guide ring 17 provided on the outer periphery thereof toprevent the substrate 10 from becoming dislodged from the lower surfaceof the top ring 12 during polishing. The guide ring 17 is secured to thetop ring 12. The lower end surface of the guide ring 17 projects fromthe substrate holding surface of the top ring 12 so that the substrate10 is held in a recess defined inside the projecting lower end of theguide ring 17.

[0074] With the above-described arrangement, the substrate 10 to bepolished is attached on the lower surface of the top ring 12. Thesubstrate 10 is pressed against the polishing surface constitutingmember 1 on the turntable 11 by the top ring 12, and the turntable 11and the top ring 12 are rotated to cause relative movement between thepolishing surface constituting member 1 and the substrate 10, therebypolishing the substrate 10. At this time, the abrasive liquid Q issupplied onto the polishing surface constituting member 1 from theabrasive liquid supply nozzle 13. A liquid containing abrasive grains,for example, fine silica particles, is used as the abrasive liquid Q.The polishing apparatus can polish the surface of the substrate 10 flatand uniformly because it uses the polishing surface constituting member1 according to the present invention.

[0075] It should be noted that the polishing apparatus using thepolishing surface constituting member 1 according to the presentinvention is not necessarily limited to that shown in FIG. 9. Thepolishing surface constituting member 1 according to the presentinvention is applicable to any polishing apparatus wherein a substrateto be polished is pressed against a polishing pad and polished byrelative movement therebetween.

[0076] For example, the present invention may be applied to a polishingapparatus as shown in FIG. 10. The polishing apparatus has a polishingtable 33 arranged such that a polishing sheet 1-2 as a polishing surfaceconstituting member 1 unwound from a polishing sheet feed drum 31 iswound onto a polishing sheet take-up drum 32 via a back plate 30. Thepolishing apparatus further has a top ring 12. A substrate 10 to bepolished that is held by the rotating top ring 12 is pressed against thepolishing sheet 1-2 passing over the upper surface of the back plate 30of the polishing table 33, thereby polishing the substrate 10.

[0077] The present invention may also be applied to a polishingapparatus as shown in FIG. 11. The polishing apparatus has a rotary drum34 having a polishing sheet 1-2 bonded to the outer peripheral surfacethereof as a polishing surface constituting member 1. The polishingapparatus further has a top ring 12. A substrate 10 to be polished thatis held by the rotating top ring 12 is pressed against the polishingsheet 1-2 on the rotary drum 34, thereby polishing the substrate 10.

[0078] In the polishing apparatus of the present invention, thepolishing surface constituting member 1 confusing-consider eliminatingwhich contacts and polishes the surface of the substrate 10 to bepolished can be constituted by a grinder or a pad or a sheet whichcontains abrasive grains.

[0079] As has been described above, the present invention provides thefollowing advantages.

[0080] According to the first aspect of the present invention, thesurface of the polishing surface constituting member that comes incontact with an object to be polished is provided with grooves at apredetermined pitch or provided with projections in a predeterminedconfiguration. Therefore, the follow-up capability of the polishingsurface constituting member with respect to the object being polished isimproved, and overpolishing at the edge of the object to be polished isminimized. Accordingly, the surface of the object can be polished flatand uniformly.

[0081] According to the second aspect of the present invention, thepolishing surface constituting member has a laminated structureincluding at least two layers, and the grooves or grooves providedbetween the projections extend to the surface of a layer of thepolishing surface constituting member immediately subsequent to a layerthereof that comes in contact with the object to be polished. Therefore,the follow-up capability of the polishing surface constituting memberwith respect to the object being polished is further improved, andoverpolishing at the edge of the object to be polished is furtherminimized. Accordingly, the surface of the object can be polished evenmore flat and uniformly.

[0082] According to the third aspect of the present invention, thepolishing surface constituting member has a laminated structureincluding at least two layers, and the grooves or grooves providedbetween the projections extend into a layer of the polishing surfaceconstituting member immediately subsequent to a layer thereof that comesin contact with the object to be polished. Therefore, the width of thegrooves can be narrowed without degrading the follow-up capability ofthe polishing surface constituting member with respect to the objectbeing polished, and the surface of the object can be polished still moreflat and uniformly.

[0083] According to the fourth aspect of the present invention, at leastone of underlying layers of the polishing surface constituting membersubsequent to the layer thereof that comes in contact with the object tobe polished is a layer pressurized by a fluid. Therefore, the follow-upcapability of the polishing surface constituting member with respect tothe object being polished is further improved by properly varying thepressure of the fluid. Accordingly, overpolishing at the edge of theobject to be polished is minimized, and the surface of the object can bepolished flat and uniformly. Even if the layer of the polishing surfaceconstituting member that comes in contact with the object to be polishedis reduced in thickness, stable polishing can be performed because thepressure applied to the object to be polished can be held constant.

[0084] According to the fifth aspect of the present invention, thepolishing apparatus uses the polishing surface constituting memberaccording to any one of the first to fourth aspects of the presentinvention. Therefore, the polishing apparatus can polish the surface ofthe object flat and uniformly.

[0085] It should be noted that the present invention is not necessarilylimited to the foregoing embodiments but can be modified in a variety ofways.

What is claimed is:
 1. A polishing surface constituting member forpolishing an object to be polished by pressing said object against saidpolishing surface constituting member under a predetermined pressure andcausing relative movement between said object and said polishing surfaceconstituting member, wherein a surface of said polishing surfaceconstituting member that comes in contact with said object is providedwith grooves at a predetermined pitch or provided with projections in apredetermined configuration.
 2. A polishing surface constituting memberaccording to claim 1, which has a laminated structure including at leasttwo layers, wherein said grooves or grooves provided between saidprojections extend to a surface of a layer of said polishing surfaceconstituting member immediately subsequent to a layer thereof that comesin contact with said object to be polished.
 3. A polishing surfaceconstituting member according to claim 2, wherein at least one ofunderlying layers of said polishing surface constituting membersubsequent to the layer thereof that comes in contact with said objectto be polished is a layer pressurized by a fluid.
 4. A polishing surfaceconstituting member according to claim 1, which has a laminatedstructure including at least two layers, wherein said grooves or groovesprovided between said projections extend into a layer of said polishingsurface constituting member immediately subsequent to a layer thereofthat comes in contact with said object to be polished.
 5. A polishingsurface constituting member according to claim 4, wherein at least oneof underlying layers of said polishing surface constituting membersubsequent to the layer thereof that comes in contact with said objectto be polished is a layer pressurized by a fluid.
 6. A polishingapparatus for polishing an object to be polished by pressing said objectagainst a polishing surface constituting member on a polishing tableunder a predetermined pressure and causing relative movement betweensaid object and said polishing surface constituting member, wherein saidpolishing surface constituting member is the polishing surfaceconstituting member according to claim
 1. 7. A polishing apparatus forpolishing an object to be polished by pressing said object against apolishing surface constituting member on a polishing table under apredetermined pressure and causing relative movement between said objectand said polishing surface constituting member, wherein said polishingsurface constituting member is the polishing surface constituting memberaccording to claim
 2. 8. A polishing apparatus for polishing an objectto be polished by pressing said object against a polishing surfaceconstituting member on a polishing table under a predetermined pressureand causing relative movement between said object and said polishingsurface constituting member, wherein said polishing surface constitutingmember is the polishing surface constituting member according to claim4.
 9. A polishing surface constituting member according to claim 1,which has a laminated structure including at least two layers, whereinsaid grooves or grooves provided between said projections extend shortof a surface of a layer of said polishing surface constituting memberimmediately subsequent to a layer thereof that comes in contact withsaid object to be polished.